Avoid Most Common PCB Manufacturing Issues
Avoid Most Common PCB Manufacturing Issues
We can make PCB Fabrication process by recognizing the possible faults in them and optimizing the manufacturing. For PCB makers, one of the major questions that arise in the mind around a new product introduction (NPI) is “How do they make sure the quality and sustainability of the process involved in PCB manufacturing?”
The identification of issues and defects in the PCB fabrication process and manufacturing may bring rapid progress, save costs for redesign and testing, and also increase the warranty if they are not detected then they damage the reputation of the brand among customers. In this article, we will discuss the major issues in PCB manufacturing. So, read this article if you want to make the PCB fabrication process and manufacturing efficiency.
Most Common PCB Manufacturing Issues
Here, we will discuss major issues that PCB manufacturers should prevent:
1. Acid Traps
Acid Traps are little spaces on the PCB, commonly the sharp corners in which etching solutions are stuck. These etchings are used to band access coppers from the board during the PCB fabrication process and manufacturing.
If the etching is stuck, it may cause tunneling by the board, which in results caused rust to the traces and can lead to faulty traces.
Causes
Traces that are linked to the holes without teardrops are commonly linked at the sharp corners and angles that may cause the creation of acid traps.
Solution
When PCB developers faced this issue, they should check the sharp corners. They should check the pattern, which is connected to the pads. It enables them to fix the route, which creates issues.
2. BGA Spacing
BGA is the major element to merge high-performance ICs into dense PCBs. but it may cause numerous issues that PCB developers should keep in mind to make sure the better performance of BGA chips. The issue with BGA pads is one of the issues that developers may face during the PCB fabrication process or manufacturing. It may be expensive to fix the issues after some time. Need a website developer for develop PCB website then contact here
Causes
The common issue that developers may face with BGA chips is related to pads for the ball grind inside the die.
Solution
The correct spacing strategy around BGA pads enables the right connectivity of components.
3. Tombstone Effect
Tombstoning is also an issue that PCB developers may face during the PCB manufacturing and fabrication process. It is caused due to incorrect wetting. When solder paste starts melting, an unfair torque at the end of the terminal results from the components lifting from an end.
Causes
A distinction is linked to traces of all pads of the two-pin device causing distinction in fusing time throughout a reflowing process caused by the tombstone components.
Solution
PCB developers can resolve this issue by comparing the ratio of linked traces. Because of the distinction in heat-dispelling traces between two pads, one pad may need more heat to get the right connection. Therefore, by comparing the ratio of linked traces, developers may fix this issue.
4. Test Point Existence
A test point is a place in an electronic circuit that is used to watch the condition of circuitry or insert test signals. If these points are ignored in the design, equipment errors may occur which will be hard to identify during the verification process in manufacturing.
Causes
During PCB manufacturing, it is essential to add fixtures for efficient testing. It makes some points that if ignored may cause serious issues.
Solution
The developer may identify and fix the issue by checking the existence of test points in the PCB design.
If you still have question in your mind then feel free to ask in the comment section bellow.
